DIP COATING SYSTEMS
In a dip-coating process, a substrate is dipped into a liquid coating solution and then is withdrawn from the solution at a controlled speed. Coating thickness generally increases with faster withdrawal speed. A faster withdrawal speed pulls more fluid up onto the surface of the substrate before it has time to flow back down into the solution. The thickness is primarily affected by fluid viscosity, fluid density, and surface tension. As a popular alternative to spin coating, dip-coating methods are frequently employed to produce thin films from sol-gel precursors for research purposes, where it is generally used for applying films onto flat or cylindrical substrates.
Dip coaters provided by Rotalab, which are available in free-standing floor or tabletop models, are specifically designed for production applications that do not require large in-line systems. Our dip coating systems can be used to apply a range of coatings, as well as photo-resists and solder masks, that are part of printed circuit board applications -- all with a level of precision that manufacturer's demand.
Our dip coater models include a host of features that make them an ideal choice for lab and production operations.