NEGATIVE PHOTORESISTS

A photoresist is a light-sensitive material used in several processes, such as photolithography and photoengraving, to form a patterned coating on a surface, which is crucial in the whole electronic industry. Resists may be classified either as positive or negative, depending on response to exposure.

When exposed to the UV light, the negative resist becomes crosslinked/polymerized, and more difficult to dissolve in developer. Therefore, the negative resist remains on the surface of the substrate where it is exposed, and the developer solution removes only the unexposed areas. Masks used for negative photoresists, therefore, contain the inverse or photographic negative of the pattern to be transferred.

UV Lithography

Negative tone photoresists effective for broadband and i-line exposure. A variety of viscosities are available for different film thicknesses in one spin-coating step. SU-8 series offer chemically amplified, epoxy based negative resists. Applications include lift-off patterning, and the manufacture of polymeric single-mode (SM) and multi-mode (MM) waveguides.

  • SU-8

    MICROCHEM
    Negative Photoresist
    Negative Tone Photoresist
  • SU-8 2000

    MICROCHEM
    Negative Photoresist
    Negative Tone Photoresist
  • SU-8 3000

    MICROCHEM
    Negative Photoresist
    Negative Tone Photoresist
  • KMPR 1000

    MICROCHEM
    Negative Photoresist
    Negative Tone Photoresist
  • ma-N 400 & ma-N 1400

    MICRO RESIST TECHNOLOGY
    Negative Photoresist
    Negative Tone Photoresist
  • EpoCore & EpoClad

    MICRO RESIST TECHNOLOGY
    Negative Photoresist
    Negative Tone Photoresist
E-Beam / Deep UV Lithography

Negative tone photoresists effective for e-beam or deep UV exposure. A variety of viscosities are available for different film thicknesses in one spin-coating step. Applications include electroplating, master/template manufacture, and etch mask.

  • ma-N 2400 & mr-EBL 6000

    MICRO RESIST TECHNOLOGY
    Negative Photoresist
    Negative Tone Photoresist
  • UVN 2300

    DOW ELECTRONIC MATERIALS
    Negative Photoresist
    Negative Tone Photoresist
Laser Direct Writing @ 405 nm

Negative tone photoresists effective for direct laser writing at 405 nm. A variety of viscosities are available for different film thicknesses in one spin-coating step. Applications include electroplating, master/template manufacture, and etch mask.

  • mr-DWL

    MICRO RESIST TECHNOLOGY
    Negative Photoresist
    Negative Tone Photoresist
Ancillaries

A range of process chemicals such as thinners, primers, developers and removers for negative photoresists.

  • Ancillaries
    for Negative Resists

    MICRO RESIST TECHNOLOGY
    Thinner, Primer, Developer and Remover
    Negative Tone Photoresist Ancillaries